Review on Wood Deformation and Cracking during Moisture Loss

Author:

Fu Zongying1,Chen Jiaxing2,Zhang Yongyue3,Xie Feifan1,Lu Yun1ORCID

Affiliation:

1. Key Laboratory of Wood Science and Technology, State Forestry and Grassland Administration, Institute of Wood Industry, Chinese Academy of Forestry, Beijing 100091, China

2. School of Material Science and Art Design, Inner Mongolia Agricultural University, Hohhot 010018, China

3. School of Materials Science and Engineering, Nanjing Forestry University, Nanjing 210018, China

Abstract

Wood, being a natural hygroscopic material, the interaction between wood and moisture plays a crucial role in wood processing and utilization. Moisture affects the physical and mechanical properties of wood, and is also one of the main external factors that cause wood deformation and cracking. Drying shrinkage is a common phenomenon during the processing and utilization of wood induced by moisture loss. Drying stress is the main cause of wood deformation and cracking. The shrinkage differential between tangential and radial direction and moisture content gradient of wood are two reasons induced the generation of drying stresses. In this review, the existing states of moisture in wood and the interaction between water molecules and wood components were systematically summarized. The current research progress and deficiencies in three aspects including the factors resulted in deformation and cracking in wood caused by moisture loss, the correlation between wood mechanical properties and moisture, as well as the development of deformation and cracking in wood under moisture loss were discussed. This review aims to facilitate further research on the deformation and cracking of wood under moisture loss by providing valuable insights and assistance, ultimately reducing the occurrence of wood deformation and cracking. And thus, it will enhance the overall utilization of wood resources, making wood better serve human life.

Funder

National Natural Science Foundation of China

Publisher

MDPI AG

Subject

Polymers and Plastics,General Chemistry

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