The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems-Reference-Cited by-同舟云学术

The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems

Published:2018-02-28 Issue:1 Volume:8 Page:5
ISSN:2079-9268
Container-title:Journal of Low Power Electronics and Applications
language:en
Short-container-title:JLPEA

Author:

Ganguly Amlan,Ahmed M.,Singh Narde Rounak,Vashist Abhishek,Shamim Md,Mansoor Naseef,Shinde Tanmay,Subramaniam Suryanarayanan,Saxena Sagar,Venkataraman Jayanti,Indovina Mark^ORCID

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering

Link

http://www.mdpi.com/2079-9268/8/1/5/pdf

Reference121 articles.

1. An 80-Tile Sub-100-W TeraFLOPS Processor in 65-nm CMOS

2. A 48-Core IA-32 Processor in 45 nm CMOS Using On-Die Message-Passing and DVFS for Performance and Power Scaling

3. Networks on chips: a new SoC paradigm

4. Exploiting Interposer Technologies to Disintegrate and Reintegrate Multicore Processors

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