Microstructure and Mechanical Properties of Copper/Graphene Composites Fabricated via Accumulative Roll Bonding and Heat Treatment without a Controlled Atmosphere

Author:

da Cruz Ricardo Aparecido12ORCID,de Andrade Mendes Filho Anibal3,Santos Silvano Leal dos4,Santos Vinícius Torres dos5,da Silva Márcio Rodrigues5,Lobo Flávia Gonçalves5,Santos Givanildo Alves dos2ORCID,Couto Antonio Augusto1ORCID

Affiliation:

1. School of Engineering, Mackenzie Presbyterian University (UPM), São Paulo 01302-907, SP, Brazil

2. Department of Mechanics, Federal Institute of Education, Science and Technology of São Paulo, São Paulo 01109-010, SP, Brazil

3. Center for Engineering, Modeling and Applied Social Sciences, Federal University of ABC, Santo André 09210-580, SP, Brazil

4. Characterization and Processing Laboratory (LPCM), Faculty of Technology of São Paulo, Bom Retiro, São Paulo 01124-060, SP, Brazil

5. Department of Research and Development, Termomecanica São Paulo S.A., São Bernardo do Campo 09612-000, SP, Brazil

Abstract

Copper and its alloys are structural materials used in industries and engineering applications due to their excellent thermal and electrical conductivity and chemical stability. Integrating graphene, known for its exceptional electrical conductivity, into the copper matrix is a promising strategy to enhance mechanical properties without sacrificing electrical conductivity. The Accumulative Roll Bonding (ARB) process can effectively and homogeneously introduce graphene into the metal matrix and is adaptable to an industrial scale. This study investigates the impact of varying graphene concentrations and two heat treatment protocols (without a controlled atmosphere) on the mechanical and electrical properties of ARBed copper/graphene composites. Optical microscopy revealed minimal voids and graphene clumps, and the energy dispersive spectroscopy analysis revealed the absence of copper oxide in some samples. The conductivity test showed little influence of the graphene content and stress relief heat treatment temperature on electrical conductivity (~86% of the International Annealed Copper Standard) within a limited number of ARB cycles. The tensile tests did not reveal a significant influence of the graphene content and stress relief heat treatment temperature on the ultimate tensile strength (220–420 MPa) and elongation (~2%).

Publisher

MDPI AG

Subject

General Materials Science,Metals and Alloys

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