A High-Reliability 12T SRAM Radiation-Hardened Cell for Aerospace Applications
Author:
Affiliation:
1. Key Laboratory for Wide Band Gap Semiconductor Materials and Devices of Education Ministry, School of Microelectronics, Xidian University, Xi’an 710071, China
2. SMiT Group Fuxin Technology Limited, Shenzhen 518000, China
Abstract
Funder
National Defense Science and Technology Foundation Strengthening Program
Xidian University and SMiT Group Fuxin Technology Limited
Publisher
MDPI AG
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
Link
https://www.mdpi.com/2072-666X/14/7/1305/pdf
Reference30 articles.
1. Single-Event Response of 22nm Fully Depleted Silicon-on-Insulator Static Random Access Memory;Casey;IEEE Trans. Nucl. Sci.,2021
2. A 1.2 V Highly Reliable RHBD 10T SRAM Cell for Aerospace Application;Dohar;IEEE Trans. Electron. Devices,2021
3. Current and Future Challenges in Radiation Effects on CMOS Electronics;Dodd;IEEE Trans. Nucl. Sci.,2010
4. Single-Event Multiple Effect Tolerant RHBD14T SRAM Cell Design for Space Applications;CH;IEEE Trans. Device Mater. Reliab.,2021
5. Kahng, A.B. (2013, January 29). The ITRS Design Technology and System Drivers Roadmap: Process and Status. Proceedings of the 2013 50th ACM/EDAC/IEEE Design Auto-mation Conference (DAC), Austin, TX, USA.
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