A High-Reliability 12T SRAM Radiation-Hardened Cell for Aerospace Applications

Author:

Yao Ruxue1,Lv Hongliang1ORCID,Zhang Yuming1,Chen Xu1,Zhang Yutao1,Liu Xingming2,Bai Geng2

Affiliation:

1. Key Laboratory for Wide Band Gap Semiconductor Materials and Devices of Education Ministry, School of Microelectronics, Xidian University, Xi’an 710071, China

2. SMiT Group Fuxin Technology Limited, Shenzhen 518000, China

Abstract

The static random-access memory (SRAM) cells used in the high radiation environment of aerospace have become highly vulnerable to single-event effects (SEE). Therefore, a 12T SRAM-hardened circuit (RHB-12T cell) for the soft error recovery is proposed using the radiation hardening design (RHBD) concept. To verify the performance of the RHB-12T, the proposed cell is simulated by the 28 nm CMOS process and compared with other hardened cells (Quatro-10T, WE-Quatro-12T, RHM-12T, RHD-12T, and RSP-14T). The simulation results show that the RHB-12T cell can recover not only from single-event upset caused by their sensitive nodes but also from single-event multi-node upset caused by their storage node pairs. The proposed cell exhibits 1.14×/1.23×/1.06× shorter read delay than Quatro-10T/WE-Quatro-12T/RSP-14T and 1.31×/1.11×/1.18×/1.37× shorter write delay than WE-Quatro-12T/RHM-12T/RHD-12T/RSP-14T. It also shows 1.35×/1.11×/1.04× higher read stability than Quatro-10T/RHM-12T/RHD-12T and 1.12×/1.04×/1.09× higher write ability than RHM-12T/RHD-12T/RSP-14T. All these improvements are achieved at the cost of a slightly larger area and power consumption.

Funder

National Defense Science and Technology Foundation Strengthening Program

Xidian University and SMiT Group Fuxin Technology Limited

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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