Affiliation:
1. Department of Mechanical System Design Engineering, Seoul National University of Science and Technology, Seoul 01811, Republic of Korea
Abstract
This study simulated the deformation of a hot runner manifold and nozzle assembly during operation, aiming to address potential leaks and premature failure. Both thermal and mechanical models were used simultaneously to accurately capture system behavior. A simplified set of boundary conditions was proposed for efficient problem-solving. Analysis of the simulation results revealed that thermal deformation posed a risk of catastrophic failures and leaks. Deformation from melt pressure was relatively small compared to thermal loading, not exceeding 12%. The study provided design recommendations based on the simulation findings, guiding the development of hot runner systems for improved reliability.
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
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