Numerical Solution of the Electric Field and Dielectrophoresis Force of Electrostatic Traveling Wave System

Author:

Yu Yue12,Luo Yao3,Cilliers Jan12,Hadler Kathryn12,Starr Stanley2,Wang Yanghua12

Affiliation:

1. Resource Geophysics Academy, Imperial College London, London SW7 2BP, UK

2. Department of Earth Science and Engineering, Imperial College London, London SW7 2AZ, UK

3. School of Electrical Engineering and Automation, Wuhan University, Wuhan 430072, China

Abstract

Electrostatic traveling wave (ETW) methods have shown promising performance in dust mitigation of solar panels, particle transport and separation in in situ space resource utilization, cell manipulation, and separation in biology. The ETW field distribution is required to analyze the forces applied to particles and to evaluate ETW design parameters. This study presents the numerical results of the ETW field distribution generated by a parallel electrode array using both the charge simulation method (CSM) and the boundary element method (BEM). A low accumulated error of the CSM is achieved by properly arranging the positions and numbers of contour points and fictitious charges. The BEM can avoid the inconvenience of the charge position required in the CSM. The numerical results show extremely close agreement between the CSM and BEM. For simplification, the method of images is introduced in the implementation of the CSM and BEM. Moreover, analytical formulas are obtained for the integral of Green’s function along boundary elements. For further validation, the results are cross-checked using the finite element method (FEM). It is found that discrepancies occur at the ends of the electrode array. Finally, analyses are provided of the electric field and dielectrophoretic (DEP) components. Emphasis is given to the regions close to the electrode surfaces. These results provide guidance for the fabrication of ETW systems for various applications.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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