Structural Health Monitoring: An IoT Sensor System for Structural Damage Indicator Evaluation

Author:

Muttillo MircoORCID,Stornelli VincenzoORCID,Alaggio Rocco,Paolucci Romina,Di Battista Luca,de Rubeis TullioORCID,Ferri GiuseppeORCID

Abstract

In the last decades, the applications of structural monitoring are moving toward the field of civil engineering and infrastructures. Nevertheless, if the structures have damages, it does not mean that they have a complete loss of functionality, but rather that the system is no longer in an optimal condition so that, if the damage increases, the structure can collapse. Structural Health Monitoring (SHM), a process for the identification of damage, periodically collects data from suitable sensors that allow to characterize the damage and establishes the health status of the structure. Therefore, this monitoring will provide information on the structure condition, mostly about its integrity, in a short time, and, for infrastructures and civil structures, it is necessary to assess performance and health status. The aim of this work is to design an Internet of Things (IoT) system for Structural Health Monitoring to find possible damages and to see how the structure behaves over time. For this purpose, a customized datalogger and nodes have been designed. The datalogger is able to acquire the data coming from the nodes through RS485 communication and synchronize acquisitions. Furthermore, it has an internal memory to allow for the post-processing of the collected data. The nodes are composed of a digital triaxial accelerometer, a general-purpose microcontroller, and an external memory for storage measures. The microcontroller communicates with an accelerometer, acquires values, and then saves them in the memory. The system has been characterized and the damage indicator has been evaluated on a testing structure. Experimental results show that the estimated damage indicator increases when the structure is perturbed. In the present work, the damage indicator increased by a maximum value of 24.65 when the structure is perturbed by a 2.5 mm engraving.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

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