Process Chain for Ultra-Precision and High-Efficiency Manufacturing of Large-Aperture Silicon Carbide Aspheric Mirrors

Author:

Zhong Bo1,Wu Wei2ORCID,Wang Jian1,Zhou Lian1,Hou Jing1,Ji Baojian1,Deng Wenhui1,Wei Qiancai1,Wang Chunjin2ORCID,Xu Qiao1

Affiliation:

1. Laser Fusion Research Center, China Academy of Engineering Physics, Mianyang 621900, China

2. State Key Laboratory of Ultra-Precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Hong Kong 999077, China

Abstract

A large-aperture silicon carbide (SiC) aspheric mirror has the advantages of being light weight and having a high specific stiffness, which is the key component of a space optical system. However, SiC has the characteristics of high hardness and multi-component, which makes it difficult to realize efficient, high-precision, and low-defect processing. To solve this problem, a novel process chain combining ultra-precision shaping based on parallel grinding, rapid polishing with central fluid supply, and magnetorheological finishing (MRF) is proposed in this paper. The key technologies include the passivation and life prediction of the wheel in SiC ultra-precision grinding (UPG), the generation and suppression mechanism of pit defects on the SiC surface, deterministic and ultra-smooth polishing by MRF, and compensation interference detection of the high-order aspheric surface by a computer-generated hologram (CGH). The verification experiment was conducted on a Ø460 mm SiC aspheric mirror, whose initial surface shape error was 4.15 μm in peak-to-valley (PV) and a root-mean-square roughness (Rq) of 44.56 nm. After conducting the proposed process chain, a surface error of RMS 7.42 nm and a Rq of 0.33 nm were successfully obtained. Moreover, the whole processing cycle is only about 216 h, which sheds light on the mass production of large-aperture silicon carbide aspheric mirrors.

Funder

Youth Talent Fund of the Laser Fusion Research Center, the China Academy of Engineering Physics

Research and Innovation Office of the Hong Kong Polytechnic University

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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