Single Layer Lift-Off of CSAR62 for Dense Nanostructured Patterns

Author:

Ohlin Hanna1ORCID,Frisk Thomas1ORCID,Vogt Ulrich1ORCID

Affiliation:

1. Department of Applied Physics, Biomedical and X-ray Physics, KTH Royal Institute of Technology, Albanova University Center, 106 91 Stockholm, Sweden

Abstract

Lift-off processing is a common method of pattern transfer for different nanofabrication applications. With the emergence of chemically amplified and semi-amplified resist systems, the possibilities for pattern definition via electron beam lithography has been widened. We report a reliable and simple lift-off process for dense nanostructured pattern in CSAR62. The pattern is defined in a single layer CSAR62 resist mask for gold nanostructures on silicon. The process offers a slimmed down pathway for pattern definition of dense nanostructures with varied feature size and an up to 10 nm thick gold layer. The resulting patterns from this process have been successfully used in metal assisted chemical etching applications.

Funder

Swedish Research Council

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Reference13 articles.

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5. Mixture of ZEP and PMMA with varying ratios for tunable sensitivity as a lift-off resist with controllable undercut;Zheng;J. Vac. Sci. Technol. B Nanotechnol. Microelectron. Mater. Process. Meas. Phenom.,2016

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