Optimization and Prediction of Thermal Conductivity and Electrical Conductivity of Vacuum Sintered Ti-6Al-4V-SiC(15 Wt.%) Using Soft Computing Techniques

Author:

Hegde Adithya1ORCID,Shetty Raviraj1ORCID,Naik Nithesh1ORCID,Murthy B. R. N.1ORCID,Nayak Madhukar2,Kumar Mohan3,Shanubhogue Deepika4

Affiliation:

1. Department of Mechanical and Industrial Engineering, Manipal Institute of Technology, Manipal Academy of Higher Education, Manipal 576104, Karnataka, India

2. Department of Mechanical Engineering, Shri Madhwa Vadiraja Institute of Technology and Management, Bantakal 574115, Karnataka, India

3. Department of Mechanical Engineering, Mangalore Institute of Technology and Engineering, Moodbedri, Karkala 574225, Karnataka, India

4. Department of Physics, Manipal Institute of Technology, Manipal Academy of Higher Education, Manipal 576104, Karnataka, India

Abstract

Titanium silicon carbide (Ti3SiC2) is a novel composite material that has found a multitude of uses in the aerodynamics, automobile, and marine industries due to its excellent properties such as high strength and modulus, high thermal and electrical conductivity, high melting point, excellent corrosion resistance, and high-temperature oxidation resistance. These properties are strongly associated with physical properties and microstructural features. Due to difficulties in the synthesis of this material, there have been very few investigations on the relationship between microstructure and physical characteristics of titanium silicon carbide composites processed through powder metallurgical process. However, the importance of thermal conductivity and electrical conductivity of titanium silicon carbide composites in various potential applications has led to keen attention from several researchers. Hence, in this paper, optimization, and prediction of process input parameters during processing under vacuum sintering for achieving maximum electrical and thermal conductivity of Ti-6Al-4V-SiC(15 Wt.%) has been presented. Using Taguchi’s L9 Orthogonal Array, it has been observed that aging temperature (1150 °C), aging time (four hours), heating rate (25 °C/min), and cooling rate (5 °C/min) result in optimum input parameters for achieving the highest electrical conductivity values during the processing of Ti-6Al-4V-SiCp composites. Further, for maximum thermal conductivity values during the processing of Ti-6Al-4V-SiCp composites, aging temperature (1150 °C), aging time (four hours), heating rate (5 °C/min), and cooling rate (5 °C/min) are preferred. A second-order response surface model generated can be effectively used for predicting the electrical conductivity and thermal conductivity during the processing of Ti-6Al-4V-SiCp composites with an accuracy of 99.28% (electrical conductivity) and 99.14% (thermal conductivity). By comparing the experimental results along with the results of the mathematical model and the BPANN model results for nine trials, it was observed that the estimated value is accurate for all tests with an error of 0.39% (electrical conductivity) and 0.48% (thermal conductivity). Further, from X-ray diffraction studies and microstructural analysis, it has been observed that aging at 1150 °C for four hours resulted in the formation of a ternary carbide phase of titanium silicon carbide (Ti3SiC2), which resulted in maximum electrical conductivity (4,260,000 Ω−1 m−1) and thermal conductivity (36.42 W/m·K) of the Ti-6Al-4V-SiC (15 Wt.%) composite specimen.

Publisher

MDPI AG

Subject

Engineering (miscellaneous),Ceramics and Composites

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