Numerical Analysis and Experimental Study on Fabrication of High Aspect Ratio Tapered Ultrafine Holes by Over-Growth Electroforming Process

Abstract

High aspect ratio (HAR) ultrafine tapered holes (diameter ≤5 μm; AR ≥5) are the most important elements for some high-tech perforated metallic products, but they are very difficult to manufacture. Therefore, this paper proposes a nontraditional over-growth electroforming process. The formation mechanism of the HAR ultrafine tapered holes is investigated, and the factors controlling the geometric shape evolution are analyzed numerically. It was found that the geometric shape and dimensions of the holes are highly dependent on the diameter and thickness of the photoresist film patterns, but are hardly affected by the spacing between two neighboring patterns; the achievable diameter for a given hole depth becomes small with the increasing pattern diameter, but it becomes big with the increasing pattern thickness. These correlations can be well interpreted by the established two empirical equations that characterize the relationship between the minimum orifice of the tapered hole and the structural parameters of the photoresist film patterns previously formed on the substrate. Application of the fabricated 1500 tapered holes with 3-μm diameter and 17-AR as the nozzles of the medical precision nebulizer is also examined. The studies show that the over-growth electroforming process is highly applicable in fabricating the perforated metallic plate with HAR ultrafine tapered holes.