Lightweight 3D Dense Autoencoder Network for Hyperspectral Remote Sensing Image Classification

Author:

Bai Yang12,Sun Xiyan123,Ji Yuanfa12,Fu Wentao13,Duan Xiaoyu1

Affiliation:

1. Information and Communicaiton Schnool, Guilin University of Electronic Technology, Guilin 541004, China

2. Guangxi Key Laboratory of Precision Navigation Technology and Application, Guilin University of Electronic Technology, Guilin 541004, China

3. National & Local Joint Engineering Research Center of Satellite Navigation Positioning and Location Service, Guilin 541004, China

Abstract

The lack of labeled training samples restricts the improvement of Hyperspectral Remote Sensing Image (HRSI) classification accuracy based on deep learning methods. In order to improve the HRSI classification accuracy when there are few training samples, a Lightweight 3D Dense Autoencoder Network (L3DDAN) is proposed. Structurally, the L3DDAN is designed as a stacked autoencoder which consists of an encoder and a decoder. The encoder is a hybrid combination of 3D convolutional operations and 3D dense block for extracting deep features from raw data. The decoder composed of 3D deconvolution operations is designed to reconstruct data. The L3DDAN is trained by unsupervised learning without labeled samples and supervised learning with a small number of labeled samples, successively. The network composed of the fine-tuned encoder and trained classifier is used for classification tasks. The extensive comparative experiments on three benchmark HRSI datasets demonstrate that the proposed framework with fewer trainable parameters can maintain superior performance to the other eight state-of-the-art algorithms when there are only a few training samples. The proposed L3DDAN can be applied to HRSI classification tasks, such as vegetation classification. Future work mainly focuses on training time reduction and applications on more real-world datasets.

Funder

Guangxi Key Laboratory of Precision Navigation Technology and Application

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

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