Repair Analysis of Overlay Woven Fabric CFRP Laminates

Author:

Baysalli Osman Caglar1ORCID,Cambaz Alihan1ORCID,Görgülü Yasin Furkan2ORCID,Uluoğlu Arman1ORCID,Harman Umur Ulas1ORCID

Affiliation:

1. Turkish Aerospace Industries Incorporation

2. ISPARTA UYGULAMALI BİLİMLER ÜNİVERSİTESİ

Abstract

The increase in aerospace composites usage for structural components demands advanced repair analysis. Overlay repairs of carbon fiber-reinforced polymer laminates offer an alternative that is easier to perform and less time-consuming to produce than the widely used tapered scarf repair and stepped lap. Composite specimen manufacturing was based on both twill carbon/epoxy prepreg and wet lay-up. The repair was performed with both prepreg and wet extra plies to the parent prepreg structure. However, the design of overlay joints must be carefully investigated to avoid generating stress concentration regions at free edges. This study examined specific extra ply terminations' impact on peak stresses in the adhesive bond line. Linear finite element analysis was performed to conduct a maximum principal stress study with a focus on three joint design parameters: ply material, overply effect, and stacking sequence. FEA accurately predicted experimentally observed responses and provided further insight into the failure behavior of the structure. Results showed that overlay joints have a strong sensitivity to ply material type, the number of overply, and stacking sequence. The introduction of overplies provided protection and stiffness at joint tips, and an overply material behavior was identified. The location of 0̊ plies in the composite laminates was highlighted as an important factor. The analysis was then extended to three-dimensional FE models for verification. In conclusion, results showed that high-stress concentration in overlay joints can be mitigated with the introduction of overplies and appropriate changes in joint design parameters to reduce stress peaks at joint tips and corners.

Publisher

Sakarya University Journal of Science

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