In-process force monitoring for precision grinding semiconductor silicon wafers-Reference-Cited by-同舟云学术

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In-process force monitoring for precision grinding semiconductor silicon wafers

Published:2005 Issue:5/6 Volume:7 Page:430
ISSN:1368-2148
Container-title:International Journal of Manufacturing Technology and Management
language:en
Short-container-title:IJMTM

Author:

Couey Jeremiah A.,Marsh Eric R.,Knapp Byron R.,Vallance R. Ryan

Publisher

Inderscience Publishers

Subject

Electrical and Electronic Engineering,Information Systems and Management,Industrial and Manufacturing Engineering,Strategy and Management,Computer Science Applications

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process;Mechanical Systems and Signal Processing;2021-06

2. Machine Learning Models for Predicting Grinding Wheel Conditions Using Acoustic Emission Features;SAE International Journal of Materials and Manufacturing;2021-05-28

3. Affecting factors, optimization, and suppression of grinding marks: a review;The International Journal of Advanced Manufacturing Technology;2021-05-03

4. In-process measurement of the grinding force in silicon wafer self-rotating grinding process;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06

5. Study of a high-precision displacement sensor based on a configured moving light field with uniform scanning;Measurement Science and Technology;2020-05-05

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