Microstructural investigation of through-silicon via fabrication by pulse-reverse electroplating for high density nanoelectronics
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Published:2014
Issue:1/2/3/4
Volume:11
Page:178
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ISSN:1475-7435
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Container-title:International Journal of Nanotechnology
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language:en
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Short-container-title:IJNT
Author:
Lin Nay,Miao Jianmin,Preisser Robert
Publisher
Inderscience Publishers
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Bioengineering