Stress Concentration of One Microvoid Embedded in an Adhesive Layer under Harmonic Load
Author:
Affiliation:
1. Research Assistant, Dept. of Civil Engineering and Engineering Mechanics, Columbia Univ., New York, NY 10027.
2. Associate Professor, Dept. of Civil Engineering and Engineering Mechanics, Columbia Univ., New York, NY 10027 (corresponding author).
Publisher
American Society of Civil Engineers (ASCE)
Subject
Mechanical Engineering,Mechanics of Materials
Link
http://ascelibrary.org/doi/pdf/10.1061/%28ASCE%29EM.1943-7889.0001416
Reference34 articles.
1. Analysis of adhesive-bonded single-lap joint with an interfacial crack and a void
2. On the correlation between the mode I failure of adhesive joints and laminated composites
3. Exact Eshelby Tensor for a Dynamic Circular Cylindrical Inclusion
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