Simulation of Copper Nanowire by Comparing its Volume and Alignment range using Composite Filament Simulation 3D to predict the Resistivity of the Nanowire

Abstract

Aim: In this research work the simulation of electrical resistivity of copper nanowire by using a Novel Composite Filament Simulation Tool, and comparing the resistivity by its Volume and Alignment range. Materials and Methods: This review was done at the Simulation research lab, Saveetha School of Engineering, Chennai. The sample size computation was finished by past outcomes using clinical.com by keeping alpha error-threshold by 0.05, enrollment ratio as 0:1, 95% confidence interval, power at 80%. Group 1 and 2 are volume (N=20) and alignment range (N=20) of copper nanowire. The complete sample size was 50. Results: Comparison between these two parameters are done by independent sample test using SPSS software. There is a statistical indifference between volume and in alignment range. Copper nanowire based on its volume (55%) showed higher resistivity in comparison to its alignment range (50%). There appears to be a statistically significant difference (p=0.047, p<0.05) by using an independent sample T test. Copper nanowire having volume a high showed better results in comparison to its alignment range. Conclusion: Copper nanowire by volume appears to give better electrical resistivity than its alignment range.