Thermal Cycle Tests of CLCC Solder Joints: Influence of Substrate, Solder, and Pad Patterns-Reference-Cited by-同舟云学术

Thermal Cycle Tests of CLCC Solder Joints: Influence of Substrate, Solder, and Pad Patterns

Published:2020 Issue:3 Volume:18 Page:51-56
ISSN:1884-0485
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY FOR AERONAUTICAL AND SPACE SCIENCES, AEROSPACE TECHNOLOGY JAPAN
language:en
Short-container-title:AEROSPACE TECHNOLOGY JAPAN

Author:

FUKUDA Seisuke¹,ISHIDA Takayuki¹,ARAKAWA Tetsuhito¹,NAKAGAWA Tsuyoshi²,MURAO Hajime³

Affiliation:

1. Institute of Space and Astronautical Science, JAXA

2. Safety and Mission Assurance Department, JAXA

3. Meisei Electric Co., Ltd.

Publisher

Japan Society for Aeronautical and Space Sciences

Link

https://www.jstage.jst.go.jp/article/tastj/18/3/18_18.51/_pdf

Reference12 articles.

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2. 2) Wen, L., and Ross, Jr., R., G.: Comparison of LCC Solder Joint Life Predictions with Experimental Data, J. Electronic Packaging, 117 (1995), pp. 109-115.

3. 3) Burchett, S. N.: Stress Analysis of a Leadless Chip Carrier Soldered to a Ceramic Substrate, Sandia National Laboratories, SAND-90-0750C, 1991.

4. 4) Takino, T., Nomura, I., Irie, J., Nagata, S., Kamata, H., Takadama, K., Fukuda, S., Sawai, S., and Sakai, S.: Crater Detection Method Using Principle Component Analysis And Its Evaluation, Trans. JSASS Aerospace Tech. Japan, 14, ists30 (2016), pp. Pt_7–Pt_14.

5. 5) Kariya, K., Ishida, T., Sawai, S., Kinoshita, T, Kajihara, K., Iwasa, O., and Fukuda, S.: Position Estimation Using Crater-based Linear Features for Pinpoint Lunar Landing, Aerospace Technology Japan, 17 (2018), pp. 79–87 (in Japanese).