1. Infrared detectors: status and trends
2. Infrared focal plane array technology
3. High-density hybrid interconnect methodologies
4. Room temperature metal direct bonding
5. Warner K.et al.(May2006)Layer transfer of FDSOI CMOS to 150 mm InP substrates for mixed‐material integration. International Conference on Indium Phosphide and Related Materials Princeton NJ pp.226–228.