Author:
Niklaus Frank,Lu Jian-Qiang
Publisher
Wiley-VCH Verlag GmbH & Co. KGaA
Reference47 articles.
1. Adhesive wafer bonding;Niklaus;J. Appl. Phys.,2006
2. Traeger , R.K. 1976 Hermeticity of polymeric lid sealant 361 367
3. Temporary bonding/debonding for ultrathin substrates;Stefan;Solid State Technol.,2008
4. Shuangwu , M.H. Pang , D.L.W. Nathapong , S. Marimuthu , P. 2008 Temporary bonding of wafer carrier for 3D-wafer level packaging 405 411
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