P‐1.6: Junction Resistance and Junction Diffusion Depth in InGaZnO‐based Thin Film Transistors (TFTs) with Thermally induced Source/Drain Region

Author:

Zhou Zhichao1,Zhu Yiyi2,Zhou Xiaoliang1,Wang Xu1,Liu Zhongjie1,Tan Zhiwei1

Affiliation:

1. China Star Optoelectronics Technology Co., Ltd Shenzhen Guang Dong

2. Department of Electronic and Computer Engineering the Hong Kong University of Science and Technology Clear Water Bay Kowloon Hong Kong

Abstract

In this research, two typical transistors architectures(X‐bridge and Elevated‐Metal Metal‐Oxide (EMMO) TFT) and two sorts of cover layers (Al2O3 cover and Metal cover) are employed to investigate the junction resistance and its diffusion in InGaZnO‐based TFTs. While all TFTs have basically equivalent junction resistances, Metal‐covered TFTs, including both X‐bridge and EMMO structures, show larger saturated diffusion depth Δ L as well as faster diffusion speed than Al2O3‐covered TFTs.

Publisher

Wiley

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