A model for high-temperature creep incorporating both recovery and thermally activated glide
Author:
Publisher
Wiley
Subject
Condensed Matter Physics,Electronic, Optical and Magnetic Materials,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference42 articles.
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1. Primary Creep in Sn3.8Ag0.7Cu Solder. Part I: Theory, Experiments, and Data Reduction;Journal of Electronic Materials;2009-09-16
2. Transients occurring during stress dip experiments on creep of an Al-0.3wt.%Li alloy at 473 K;Materials Science and Engineering: A;1989-07
3. The Creep Behaviour of a Neutron Irradiated Al−0.3 wt% Li Alloy at 300 °C;Physica Status Solidi (a);1987-07-16
4. Shape of transient creep curves following stress change during steady state creep;Metal Science;1984-10
5. Steady-State Creep and Strain Transients for Stress-Dip Tests in Polycrystalline Magnesium at 300 °C;Physica Status Solidi (a);1984-09-16
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