Formation of faulted defects in copper by moving boundaries-Reference-Cited by-同舟云学术

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Formation of faulted defects in copper by moving boundaries

Published:1980-08-16 Issue:2 Volume:60 Page:409-415
ISSN:0031-8965
Container-title:Physica Status Solidi (a)
language:de
Short-container-title:Phys. Stat. Sol. (a)

Author:

Clarebrough L. M.,Forwood C. T.

Publisher

Wiley

Subject

Condensed Matter Physics,Electronic, Optical and Magnetic Materials,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. Stacking-fault tetrahedra in annealed f.c.c. metals and alloys

2. New possibilities for recrystallization study by X-Ray synchrotron radiation topography

3. and , Electron Microscopy, Vol. III. Ed. Microscopical Soc. of Canada, Ontario 1978 (p. 380).

4. , , , and , Computed Electron Micrographs and Defect Identification, North-Holland Publ. Co., Amsterdam/London 1973.

5. Serration and dissociation of edge dislocations in low angle tilt boundaries in gold

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The formation of grain boundary gamma during cooling of Ti46Al8Nb;Intermetallics;2009-05

2. Formation of stacking-fault tetrahedra by grain boundary movement;Physica Status Solidi (a);1987-11-16

3. Rigid-body displacements at ∑9 grain boundaries;Philosophical Magazine A;1985-04

4. Dissociation of asymmetric ∑9, ∑27a and ∑81d 〈110〉 tilt boundaries;Acta Metallurgica;1984-05

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