Novel air‐filled substrate integrated waveguide bandpass filter with nonresonant node structures

Author:

Wu Yongbiao1,Yang Kai12,Chen Peng12,Zhang Lanhai1,Li Guopeng1

Affiliation:

1. School of Aeronautics and Astronautics University of Electronic Science and Technology of China Chengdu China

2. Laboratory Aircraft Swarm Intelligent Sensing and Cooperative Control Key Laboratory of Sichuan Province Chengdu China

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. ParmentF GhiottoA VuongTP DuchampJM WuK. Broadband transition from dielectric‐filled to air‐filled substrate integrated waveguide for low loss and high power handling millimeter‐wave substrate integrated circuits: Proceedings of the IEEE MTT‐S International Microwave Symposium (IMS2014) Tampa FL USA 1‐6 June 2014. Piscataway NJ: IEEE Press; 2014.

2. MartinT GhiottoA VuongT. Air‐filled substrate integrated waveguide (AFSIW) filter with asymmetric frequency response: Proceedings of the XXXIIIrd General Assembly and Scientific Symposium of the International Union of Radio Science Rome Italy 29 August‐5 September 2020. Piscataway NJ: IEEE Press;2020.

3. MartinT GhiottoA VuongTP WuK LotzF. Compact quasi‐elliptic and highly selective AFSIW filter with multilayer cross‐coupling:Proceedings of the IEEE MTT‐S International Microwave Symposium (IMS) Boston MA USA 2‐7 June 2019. Piscataway NJ: IEEE Press;2019:718–721.

4. ParmentF GhiottoA VuongTP DuchampJM WuK. Low‐loss air‐filled substrate integrated waveguide (SIW) band‐pass filter with inductive posts:Proceedings of the European Microwave Conference (EuMC) Paris France 7‐10 September 2015. Piscataway NJ: IEEE Press;2015:761–764.

5. MartinT GhiottoA LotzF VuongTP. Fabrication‐tolerant reconfigurable AFSIW filters based on through‐hole mounted metallic posts for versatile high performance systems:Proceedings of the IEEE/MTT‐S International Microwave Symposium – IMS Philadelphia PA USA 10‐15 June 2018. Piscataway NJ: IEEE Press;2018:319–322.

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