Next Generation Chip Embedding Technology for High Efficiency Power Modules and Power SiPs-Reference-Cited by-同舟云学术

Next Generation Chip Embedding Technology for High Efficiency Power Modules and Power SiPs

Published:2021-12-03 Issue: Volume: Page:169-192
ISSN:
Container-title:Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
language:
Short-container-title:

Author:

Gupta Vikas,Essig Kay,Chiu C.T.,Gerber Mark

Publisher

Wiley

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/9781119793908.ch7

Reference6 articles.

1. Alderman A. Burgyan L. Kakizaki Y. Hama Y. Nakagawa H. Böttcher L.andLöherT.(2015).Current developments in 3D packaging with focus on embedded substrate technologies.PSMA Technology Report.

2. Alderman A. Burgyan L. Narveson B.andParkerE.(2015).3D embedded technology: analyzing its needs and challenges.IEEE Power Electronics Magazine (December) pp. 30–39.

3. Essig K.(2015).Embedded die substrate solutions for power applications. IMAPS France Power Electronics Workshop Session 2 Tours France.

4. Essig K. Chiu C.T. Kuo J. Chen P.andYannou J.M.(eds). (2016).Higher efficiency power module integrated solutions by chip embedding.Proceedings of International Symposium on Microelectronics. Pasadena USA (10–13 October 2016). USA: IMAPS.

5. Appelt B. K. Su B. Lee D. Yen U.andHungM.Eds. (2011).Embedded component substrates moving forward.IEEE 13th Electronics Packaging Technology Conference Proceedings. Singapore (7–9 December 2011). USA: IEEE.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Toward 2.5D Structures for Multi-Channel MEMS Acoustic-Based Digital Isolators using Through Silicon Openings;2023 21st IEEE Interregional NEWCAS Conference (NEWCAS);2023-06-26