UV/heat dual-curable adhesive tapes for fabricating stacked packages of semiconductors
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Reference18 articles.
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2. In Super Micro Package—CSP/BGA Technology; The Nikkan Kogyo Newspaper: Tokyo, 1998; p 105.
3. Preformed particle toughening of epoxy-based film adhesive systems: The effect of particle size and chemistry
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