Rheological study of the curing kinetics of epoxy–phenol novolac resin
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Reference39 articles.
1. Thermomechanical properties of 1C molding compounds
2. Contributions of the network structure to the cure kinetics of epoxy resin systems according to the change of hardeners
3. Structure–property relationships of void-free phenolic–epoxy matrix materials
4. Epoxy thermosetting systems: Dynamic mechanical analysis of the reactions of aromatic diamines with the diglycidyl ether of bisphenol A
5. Gelation study of high processability and high reliability ternary systems based on benzoxazine, epoxy, and phenolic resins for an application as electronic packaging materials
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