Thermal characteristics of 3kV, 600A 4H-SiC flat-package pn diodes

Author:

Ogata Syuji,Takayama Daisuke,Asano Katsunori,Sugawara Yoshitaka

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

Reference11 articles.

1. Performances and application impacts of widegap power semiconductor devices-Focusing on SiC;Sugawara;IEICE Trans Electron,1998

2. Rapidly advancing developments of SiC power devices and their applications;Sugawara;IEEJ J,2005

3. 6.2 kV 4H-SiC pin diode with low forward voltage drop;Sugawara;Materials Science Forum,2000

4. Sugawara Y, Takayama D, Asano K, Singh R, Palmour J, Hayashi T. 12-19 kV 4H-SiC pin diodes with low power loss. Proc 2001 International Symposium on Power Semiconductor Devices & ICs, p 27-30, Osaka.

5. Sugawara Y, Asaano K. 1.4 kV 4H-SiC UMOSFET with low specific on-resistance. Proc 1998 International Symposium on Power Semiconductor Devices & ICs, p 119-122, Kyoto.

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