Adhesion and debonding kinetics of photovoltaic encapsulation in moist environments-Reference-Cited by-同舟云学术

Adhesion and debonding kinetics of photovoltaic encapsulation in moist environments

Published:2015-07-27 Issue:2 Volume:24 Page:183-194
ISSN:1062-7995
Container-title:Progress in Photovoltaics: Research and Applications
language:en
Short-container-title:Prog. Photovolt: Res. Appl.

Author:

Novoa Fernando D.¹,Miller David C.²,Dauskardt Reinhold H.¹

Affiliation:

1. Department of Materials Science and Engineering; Stanford University; Stanford CA 94305-2205 USA

2. National Center for Photovoltaics; NREL; Golden CO USA

Funder

Department of Energy through the Bay Area Photovoltaic Consortium

US Department of Energy

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/pip.2657/fullpdf

Reference58 articles.

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3. Moisture-assisted subcritical debonding of a polymer/metal interface;Kook;Journal of Applied Physics,2002

4. Encapsulation of PV modules using ethylene vinyl acetate copolymer as a pottant: a critical review;Czanderna;Solar Energy Materials and Solar Cells,1996

5. Sánchez-Friera P Analysis of degradation mechanisms of crystalline silicon PV modules after 12 years of operation in Southern Europe 2011 19 6 658 666

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