Effect of heat treatment on the performance of 3D printed thermoplastic polyurethane flexible substrates

Author:

Gu Sujuan1,Ma Jing1ORCID,Kang Luhan1,Wei Hongtao1,Jiang Lin2,Wang Lixia1

Affiliation:

1. School of Mechanics and Safety Engineering Zhengzhou University Zhengzhou China

2. School of Mechanical & Electrical Engineering Henan University of Technology Zhengzhou China

Abstract

Abstract3D printing technology combined with thermoplastic polyurethane (TPU) is increasingly being used in flexible electronics. However, the defects induced by 3D printing may degrade the mechanical properties of the TPU substrates significantly and result in the decrease in breaking elongation, tensile strength, and waterproof performance. In this article, we investigate the effect of heat treatment on improving the mechanical and waterproof properties of TPU substrate experimentally. The results show that heat treatment can effectively reduce the defects such as bubbles and pores inside the 3D printed TPU structure and increase the bonding area of the filament, and thus making the 3D printed TPU structure dense. After heat treatment at 180°C, the tensile strength and elongation at break of 3D printed TPU samples in the fiber direction (filling angle of 0°) increased by 67% and 38%, respectively. The tensile strength and elongation at break in the bonding direction (filling angle of 90°) increased by 100% and 75%. In addition, the waterproof performance of the samples has been enhanced, and the water contact angle of the surface has increased from 90.4°to 95.25°. Therefore, the heat treatment can effectively improve the mechanical properties and waterproof performance of 3D printed TPU samples.

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference29 articles.

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. IrOnTex: Using Ironable 3D Printed Objects to Fabricate and Prototype Customizable Interactive Textiles;Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies;2024-08-22

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3