Numerical Simulation of HTPB Resin Curing Process Using OpenFOAM and Study the Effect of Different Conditions on its Curing Time
Author:
Affiliation:
1. Department of Chemical Engineering Malek Ashtar University of Technology Tehran Iran 22940000
Publisher
Wiley
Subject
General Chemical Engineering,General Chemistry
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/prep.202000321
Reference28 articles.
1. Curing Viscosity of HTPB-Based Binder Embedding Micro- and Nano-Aluminum Particles
2. Cure Cycle Optimization for the Reduction of Processing-Induced Residual Stresses in Composite Materials
3. Thermal curing kinetics optimization of epoxy resin in Digital Light Synthesis
4. Finite element modeling of polymer curing in natural fiber reinforced composites
5. Kinetic studies of thermoset cure reactions: A review
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