Numerical Simulation of HTPB Resin Curing Process Using OpenFOAM and Study the Effect of Different Conditions on its Curing Time
Author:
Affiliation:
1. Department of Chemical Engineering Malek Ashtar University of Technology Tehran Iran 22940000
Publisher
Wiley
Subject
General Chemical Engineering,General Chemistry
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/prep.202000321
Reference28 articles.
1. Curing Viscosity of HTPB-Based Binder Embedding Micro- and Nano-Aluminum Particles
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