Fabrication and Evaluation of MUT‐Type Acoustic Metamaterial for Impedance Matching

Author:

Tanaka Hiroki1,Machida Shuntaro1,Nanri Mitsuhiko2

Affiliation:

1. Research and Development Group Hitachi, Ltd., 1‐280 Higashi‐koigakubo, Kokubunji‐shi Tokyo 185‐8601 Japan

2. Defense Systems Division Hitachi, Ltd., 292, Yoshida‐chou, Totsuka‐ku Yokohama‐shi 244‐0817 Kanagawa Japan

Abstract

A micromachined ultrasonic transducer (MUT)‐type acoustic metamaterial that achieved acoustic impedance matching between materials with different acoustic impedances was successfully fabricated. The fabricated device consisted of a thin membrane that vibrated when acoustic waves impinged on the surface of the device, along with tapered trench structures located beneath the membrane. The device fabrication process consisted of seven steps, using four silicon wafers. An acoustic evaluation of the system with the fabricated MUT‐type acoustic metamaterial showed that the water‐to‐silicon transmission property was 30% higher than that of a system without the MUT‐type acoustic metamaterial. This result confirms that MUT‐type acoustic metamaterials are useful for matching the acoustic impedance between materials with different acoustic impedances. © 2024 Institute of Electrical Engineer of Japan and Wiley Periodicals LLC.

Publisher

Wiley

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