Ultra‐lightweight <scp>3D</scp> woven spacer integrated composites with stabilization of dielectric and robust mechanical properties at room and elevated temperatures-Reference-Cited by-同舟云学术

Ultra‐lightweight 3D woven spacer integrated composites with stabilization of dielectric and robust mechanical properties at room and elevated temperatures

Published:2022-07-21 Issue:9 Volume:43 Page:6125-6134
ISSN:0272-8397
Container-title:Polymer Composites
language:en
Short-container-title:Polymer Composites

Author:

Zheng Liangang¹²^ORCID,Zhang Kun¹²,Li Wuzhou¹²,Xu Fujun¹²^ORCID

Affiliation:

1. Shanghai Frontier Science Research Center for Modern Textiles Donghua University Shanghai People's Republic of China

2. College of textiles Donghua University Shanghai People's Republic of China

Funder

Fundamental Research Funds for the Central Universities

Natural Science Foundation of Shanghai

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Ceramics and Composites

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pc.26917

Reference38 articles.

1. Well-organized organosilane composites for adhesion enhancement of heterojunctions

2. Finite element simulation and analysis of the dielectric properties of unidirectional aramid/epoxy composites

3. High-Frequency Radomes for Polar Region Ground Stations: The State of the Art and Novel Developments of Radome Technologies

4. Enhanced toughness and lowered dielectric loss of reactive POSS modified bismaleimide resin as well as the silica fiber reinforced composites

5. Fabrication of bismuth silicate Bi2SiO5 ceramics as a potential high-temperature dielectric material

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