High-performance hexagonal boron nitride/bismaleimide composites with high thermal conductivity, low coefficient of thermal expansion, and low dielectric loss-Reference-Cited by-同舟云学术

High-performance hexagonal boron nitride/bismaleimide composites with high thermal conductivity, low coefficient of thermal expansion, and low dielectric loss

Published:2011-06-17 Issue:5 Volume:23 Page:919-928
ISSN:1042-7147
Container-title:Polymers for Advanced Technologies
language:en
Short-container-title:Polym. Adv. Technol.

Author:

Gao Yuwen¹,Gu Aijuan¹,Jiao Yicheng¹,Yang Yulu¹,Liang Guozheng¹,Hu Jiang-tao¹,Yao Wei¹,Yuan Li¹

Affiliation:

1. Jiangsu Key Laboratory of Advanced Functional Polymer Design and Application; Department of Materials Science and Engineering; College of Chemistry, Chemical Engineering and Materials Science; Soochow University; Suzhou; 215123; China

Publisher

Wiley

Subject

Polymers and Plastics

Reference42 articles.

1. A self-healing carbon fibre reinforced polymer for aerospace applications

2. Effect of polyethersulfone and N,N’-bismaleimido-4,4’-diphenyl methane on the mechanical and thermal properties of epoxy systems

3. Thermally conductive silicone rubber reinforced with boron nitride particle

4. Preparation and Characterization of Organic/Inorganic Polymer Composites Based on Mg-Silicates

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