1. Online resources accessible as of 14 January 2024.https://www.businesswire.com/news/home/20210408005505/en/Global‐Thermal‐Interface‐Materials‐Market‐for‐5G‐2021‐to‐2026‐ResearchAndMarkets.com
2. Isotropically Ultrahigh Thermal Conductive Polymer Composites by Assembling Anisotropic Boron Nitride Nanosheets into a Biaxially Oriented Network
3. Online resources Accessible as of 14 January 2024.https://www.researchandmarkets.com/reports/5851740
4. Curing agents for epoxy resin by Three Bond (online) December1990. 10 pages.https://www.threebond.co.jp/en/technical/technicalnews/pdf/tech32.pdf
5. Tsang J.W.(2020 July 14). Curing agents for hydrophobic epoxy compositions.US Patent US10 711154 B1.https://www.freepatentsonline.com/10711154.pdf