High‐density implantable neural electrodes and chips for massive neural recordings

Author:

Wang Longchun123,Suo Yanxing1ORCID,Wang Jiahao456,Wang Xuanqi456,Xue Kai456,An Jingjing123,Sun Xun7,Chen Qinyu8,Tang Xiaochen9,Zhao Yang1ORCID,Ji Bowen456ORCID,Liu Jingquan123ORCID

Affiliation:

1. Department of Micro/Nano Electronics Shanghai Jiao Tong University Shanghai China

2. National Key Laboratory of Advanced Micro and Nano Manufacture Technology Shanghai Jiao Tong University Shanghai China

3. DCI Joint Team Collaborative Innovation Center of IFSA Shanghai Jiao Tong University Shanghai China

4. Unmanned System Research Institute Northwestern Polytechnical University Xi'an Shaanxi China

5. National Key Laboratory of Unmanned Aerial Vehicle Technology Xi'an Shaanxi China

6. Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace School of Mechanical Engineering Northwestern Polytechnical University Xi'an Shaanxi China

7. Institute of Guizhou Aerospace Measuring and Testing Technology Guiyang Guizhou China

8. Leiden Institute of Advanced Computer Science (LIACS) Leiden University Leiden The Netherlands

9. Klipsch School of Electrical and Computer Engineering New Mexico State University Las Cruces New Mexico USA

Abstract

AbstractHigh‐density neural recordings with superior spatiotemporal resolution powerfully unveil cellular‐scale neural communication, showing great promise in neural science, translational medicine, and clinical applications. To achieve such, many design and fabrication innovations enhanced the electrode, chip, or both for biocompatibility improvement, electrical performance upgrade, and size miniaturization, offering several thousands of recording sites. However, an enormous gap exists along the trajectory toward billions of recording sites for brain scale resolution, posing many more design challenges. This review tries to find possible insight into mitigating the gap by discussing the latest progress in high‐density electrodes and chips for neural recordings. It emphasizes the design, fabrication, bonding techniques, and in vivo performance optimization of high‐density electrodes. It discusses the promising opportunities for circuit‐level and architecture‐level multi‐channel chip design innovations. We expect that joint effort and close collaboration between high‐density electrodes and chips will pave the way to high‐resolution neural recording tools supporting cutting‐edge neuroscience discoveries and applications.

Funder

National Key Research and Development Program of China

Postdoctoral Research Foundation of China

National Natural Science Foundation of China

Publisher

Wiley

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