Reliability analysis of electronic devices with multiple competing failure modes involving performance aging degradation
Author:
Publisher
Wiley
Subject
Management Science and Operations Research,Safety, Risk, Reliability and Quality
Reference11 articles.
1. Solder Joint Reliability: Theory and Applications. Van Nostrand Reinhold, 1991.
2. Reliability of Electronic Packages and Semiconductor Devices. McGraw-Hill, 1997.
3. Reliability and Degradation: Semiconductor Devices and Circuits. Wiley, 1981.
4. Analysis of Performance-Degradation Data from Accelerated Tests
5. Using Degradation Measures to Estimate a Time-to-Failure Distribution
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