Synthesis and properties of a low hygrothermal stress epoxy molding compound for electronic encapsulation-Reference-Cited by-同舟云学术

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Synthesis and properties of a low hygrothermal stress epoxy molding compound for electronic encapsulation

Published:2000-12 Issue:6 Volume:21 Page:953-959
ISSN:0272-8397
Container-title:Polymer Composites
language:en
Short-container-title:Polym. Compos.

Author:

Tai Horng-Jer,Wang J. B.,Chou Hui-Lung

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Ceramics and Composites

Reference25 articles.

1. Development of test vehicles for evaluating plastic-encapsulant reliability and improving thermal conductivity of encapsulant materials

2. Predicting delamination in plastic IC packages and determining suitable mold compound properties

3. An experimental study of popcorning in plastic encapsulated microcircuits

4. Plastic Packaging of Microelectronic Devices, p. 63, Van Nostrand Reinhold, New York (1990).

5. Contributions of the nanovoid structure to the moisture absorption properties of epoxy resins

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. New triepoxy monomer and composites for thermal and corrosion management;Journal of Applied Polymer Science;2020-03-19

2. Synthesis, characterization, and properties of a novel epoxy resin containing both binaphthyl and biphenyl moieties;Journal of Applied Polymer Science;2009-12-15

3. Advances in addition-cure phenolic resins;Progress in Polymer Science;2004-05

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