Improved adhesion property and electromagnetic interference shielding effectiveness of electroless Cu-plated layer on poly(ethylene terephthalate) by plasma treatment-Reference-Cited by-同舟云学术

Improved adhesion property and electromagnetic interference shielding effectiveness of electroless Cu-plated layer on poly(ethylene terephthalate) by plasma treatment

Published:2002-03-06 Issue:7 Volume:84 Page:1369-1379
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Oh Kyung Wha,Kim Dong Jun,Kim Seong Hun

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference23 articles.

1. Some plasma treatment of PET fibres and adhesion testing to rubber

2. Surface Modification of Tetrafluoroethylene−Perfluoroalkyl Vinyl Ether Copolymer (PFA) by Remote Hydrogen Plasma and Surface Metallization with Electroless Plating of Copper Metal

3. Formation of Catalytic Pd on ZnO Thin Films for Electroless Metal Deposition

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