P‐8.9: Development of High‐reliability Glass Substrate MiniLED Direct Display Encapsulation Technology and Materials
Author:
Affiliation:
1. TCL China Star Optoelectronics Technology Co., Ltd Guangdong China
Publisher
Wiley
Subject
General Medicine
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/sdtp.16133
Reference4 articles.
1. Dean in RD. Comparision of epoxy resins for application in light-emitting diodes;Huang JC;Adv Polym Technol.,2004
2. Stabilization of entrapped in water-in-silicone oil emulsions[J];Zelisko P.;Langmuir,2002
3. Research progress of LED packaging materials[J];Zhang BT;New Chemical Materials,2010
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