Cleavage Fracture of Brittle Semiconductors from the Nanometre to the Centimetre Scale-Reference-Cited by-同舟云学术

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Cleavage Fracture of Brittle Semiconductors from the Nanometre to the Centimetre Scale

Published:2005-05 Issue:5 Volume:7 Page:309-317
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv. Eng. Mater.

Author:

Wasmer K.,Ballif C.,Gassilloud R.,Pouvreau C.,Rabe R.,Michler J.,Breguet J.-M.,Solletti J.-M.,Karimi A.,Schulz D.

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Reference39 articles.

1. Non-linear dynamical analysis of crack surface perturbations and their dependence on velocity and direction

2. Nonlinear dynamic instability in brittle fracture of GaAs

3. Shearing orientation dependence of cleavage step structures on GaAs(110)

4. Process-induced stress and microcrack nucleation in GaAs wafers

5. Surface damage of soda–lime–silica glasses: indentation scratch behavior

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1. Atomic force microscopy monitoring of subcritical slow crack growth in soda lime silicate glass;Journal of the European Ceramic Society;2024-10

2. Experimental–numerical analysis of silicon micro-scratching;International Journal of Solids and Structures;2024-06

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4. Anisotropic fracture energy and toughness of single crystal gallium arsenide by microindentation;Engineering Fracture Mechanics;2023-11

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