Author:
Arbab F.,Herman I.,Spilling P.
Cited by
76 articles.
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1. The Embedded Cooling Silicon 3D Stacking Thermal Test Vehicle;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
2. A novel signal representation in SEI: Manifold;Journal of the Franklin Institute;2023-05
3. A Data-Driven Two-Phase Multi-Split Causal Ensemble Model for Time Series;Symmetry;2023-04-26
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5. Taxonomy of an Application Model;Proceedings of the 9th ACM Symposium on Design and Analysis of Intelligent Vehicular Networks and Applications;2019-11-25