In Situ/Operando Studies for Reduced Eletromigration in Ag Nanowires with Stacking Faults

Author:

Hsueh Yu‐Hsiang1,Ranjan Ashok1,Lyu Lian‐Ming1,Hsiao Kai‐Yuan1,Chang Yu‐Cheng2,Lu Ming‐Pei3,Lu Ming‐Yen4ORCID

Affiliation:

1. Department of Materials Science and Engineering National Tsing Hua University Hsinchu 300 Taiwan

2. Department of Materials Science and Engineering Feng Chia University Taichung 40724 Taiwan

3. Taiwan Semiconductor Research Institute National Applied Research Laboratories Hsinchu 30078 Taiwan

4. Department of Materials Science and Engineering High Entropy Materials Center National Tsing Hua University Hsinchu 300 Taiwan

Abstract

AbstractIn this study, the effect of stacking faults (SFs) on electromigration in silver nanowires (AgNWs) in particular, with respect to their effects on necking and void growth, is investigated. The galvanic replacement reaction is used to synthesize the AgNWs in bulk at low cost. By varying the concentration of silver nitrate, AgNWs are obtained with and without SFs. In situ TEM analysis provides strong evidence that the SFs can effectively suppress the migration of surface atoms. Furthermore, an investigation of the void growth process reveals that SF facets parallel to the {111} plane contribute to the anisotropic change in morphology and slow down the rate of void growth by 135 times. Thus, planar defects can be beneficial to extending the lifetimes of devices by causing intrinsic changes to the material properties.

Funder

Ministry of Science and Technology, Taiwan

Publisher

Wiley

Subject

Electronic, Optical and Magnetic Materials

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