Zur Löslichkeit von Kupfer in Salpetersäure nach Implantation von Metalloiden-Reference-Cited by-同舟云学术

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Zur Löslichkeit von Kupfer in Salpetersäure nach Implantation von Metalloiden

Published:1982-12 Issue:12 Volume:22 Page:456-457
ISSN:0044-2402
Container-title:Zeitschrift für Chemie
language:en
Short-container-title:Z. Chem.

Author:

Kolitsch Andreas,Mosch Hella-Beate,Richter Edgar

Publisher

Wiley

Subject

General Chemistry

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/zfch.19820221217/fullpdf

Reference10 articles.

1. Hartley , N. E. W.

2. Preece , C. M. Hirvonen , J. K. 1980

3. Fatigue-life enhancement by ion implantation

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Corrosion and electrochemical characterization of rapidly solidified CuB, CuAlB, CuCrZr alloys;Materials Science and Engineering: A;1991-03

2. Thermal oxidation of ion implanted copper;Physica Status Solidi (a);1988-08-16

3. The effect of boron implantation on the corrosion behaviour, microhardness and contact resistance of copper and silver surfaces;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1987-01

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