Author:
Finch Craig,Yang Xiaomin,Wu Thomas X.,Abbott Benjamin
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference6 articles.
1. and Analysis and optimal SAW ladder filter design including bonding wire and package impedance, Proc 1997 Ultrasonics Symp, 1997, pp. 175-178.
2. An FDTD-Touchstone hybrid technique for equivalent circuit modeling of SOP electronic packages
3. A novel approach to 3-D modeling of packaged RF power transistors
4. Effects of package parasitics on the performance of SAW filters
5. and Electromagnetic modeling of package parasitics in SAW-duplexer, Proc 1996 IEEE Ultrasonics Symp, 1996, pp. 29-32.