Changes in the Wettability of Microporous Copper Layers Prepared by Different Modes of Electrodeposition
Author:
Affiliation:
1. National Institute of Technology Department of Chemical Engineering 673601 Calicut India
2. National Institute of Technology Department of Mechanical Engineering 673601 Calicut India
Publisher
Wiley
Subject
Industrial and Manufacturing Engineering,General Chemical Engineering,General Chemistry
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/ceat.202100026
Reference34 articles.
1. Simple Chemical Method for Forming Silver Surfaces with Controlled Grain Sizes for Surface Plasmon Experiments
2. Effect of Nanostructured Microporous Surfaces on Pool Boiling Augmentation
3. Effect of electrolyte temperature on porous electrodeposited copper for pool boiling enhancement
4. Development of a two-step electrodeposition process for enhancing pool boiling
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