Unraveling the Mechanism of Electrically Induced Adhesive Debonding: A Spectro‐Microscopic Study-Reference-Cited by-同舟云学术

Unraveling the Mechanism of Electrically Induced Adhesive Debonding: A Spectro‐Microscopic Study

Published:2021-12-02 Issue:1 Volume:9 Page:2101447
ISSN:2196-7350
Container-title:Advanced Materials Interfaces
language:en
Short-container-title:Adv Materials Inter

Author:

Anduix‐Canto Clara¹,Peral Daniel²,Pérez‐Padilla Víctor³^ORCID,Diaz‐Rovira Anna Maria³,Belmez Lledó Alejandro³,Orme Christine A.⁴,Petrash Stanislas⁵,Engels Thomas⁶,Chou Kang Wei⁶^ORCID

Affiliation:

1. ALBA Synchrotron Light Source Carrer de la Llum 2–26 Cerdanyola del Vallès 08290 Spain

2. Department of Chemistry Universitat Autònoma de Barcelona Cerdanyola del Vallès 08193 Spain

3. Adhesive Research Henkel Ibérica S.A. Carrer de Bilbao 72–84 Barcelona 08005 Spain

4. Lawrence Livermore National Laboratory 7000 East Avenue Livermore CA 94550 USA

5. Adhesive Research Henkel Corporation 10 Finderne Avenue Bridgewater NJ 08807 USA

6. Adhesive Research Henkel AG & Co. KGaA Henkelstraße 67 40589 Düsseldorf Germany

Funder

Universitat Autònoma de Barcelona

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admi.202101447

Reference40 articles.

1. Adhesives for “debonding-on-demand”: Triggered release mechanisms and typical applications

2. Debonding on Demand of Adhesively Bonded Joints: A Critical Review

3. CHAPTER 13. Debondable Adhesive Systems

4. M. D.Gilbert(Eic Laboratories Inc) US 7332218 B1 2008.

5. T.Remonen P.Norberg(Stora Enso) WO 2007142600 A1 2007.

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