Assembly of Arbitrary Designer Heterostructures with Atomically Clean Interfaces

Author:

Jin Keda123,Wichmann Tobias124,Wenzel Sabine12,Samuely Tomas5,Onufriienko Oleksander5,Szabó Pavol5,Watanabe Kenji6,Taniguchi Takashi7,Yan Jiaqiang8,Tautz F. Stefan124,Lüpke Felix12,Ternes Markus123,Martinez‐Castro Jose123ORCID

Affiliation:

1. Peter Grünberg Institut (PGI‐3) Forschungszentrum Jülich 52425 Jülich Germany

2. Jülich Aachen Research Alliance Fundamentals of Future Information Technology 52425 Jülich Germany

3. Institute for Experimental Physics II B RWTH Aachen 52074 Aachen Germany

4. Institute for Experimental Physics IV A RWTH Aachen 52074 Aachen Germany

5. Centre of Low Temperature Physics, Faculty of Science Pavol Jozef Šafárik University & Institute of Experimental Physics, Slovak Academy of Sciences 04001 Košice Slovakia

6. Research Center for Electronic and Optical Materials National Institute for Materials Science 1‐1 Namiki Tsukuba 305‐0044 Japan

7. Research Center for Materials Nanoarchitectonics National Institute for Materials Science 1‐1 Namiki Tsukuba 305‐0044 Japan

8. Materials Science and Technology Division Oak Ridge National Laboratory Oak Ridge TN 37831 USA

Abstract

AbstractVan der Waals heterostructures are an excellent platform for studying intriguing interface phenomena, such as moiré and proximity effects. Many of these phenomena occurring in such heterostructures' interfaces and surfaces have so far been hampered because of their high sensitivity to disorder and interface contamination. Here, it reports a dry polymer‐based assembly technique to fabricate arbitrary designer van der Waals heterostructures with atomically clean surfaces. The key features of the suspended dry pick‐up and flip‐over assembly technique are: 1) the heterostructure surface never comes into contact with polymers, 2) the assemble is entirely solvent‐free, 3) it is entirely performed in a glovebox, and 4) it only requires temperatures below 130 °C. By performing ambient atomic force microscopy and atomically‐resolved scanning tunneling microscopy on example heterostructures, it demonstrates the fabrication of air‐sensitive heterostructures with ultra‐clean interfaces and surfaces. It envisions that, due to the avoidance of polymer melting, this technique is potentially compatible with heterostructure assembly under ultra‐high vacuum conditions, which promises ultimate heterostructure quality.

Funder

Deutsche Forschungsgemeinschaft

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

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