3D Architectural MXene‐based Composite Films for Stealth Terahertz Electromagnetic Interference Shielding Performance

Author:

Theja Vaskuri C. S.1ORCID,Assi Dani S.2ORCID,Huang Hongli2,Alsulami Raghad Saud2,Chen Bao Jie3ORCID,Chan Chi Hou3ORCID,Shek Chan‐Hung1,Karthikeyan Vaithinathan2ORCID,Roy Vellaisamy A. L.4ORCID

Affiliation:

1. Department of Materials Science and Engineering City University of Hong Kong Kowloon Tong Hong Kong

2. James Watt School of Engineering University of Glasgow Glasgow Scotland G12 8QQ UK

3. State Key Laboratory for Terahertz and Millimeter Waves and Department of Electrical Engineering City University of Hong Kong Kowloon Tong Hong Kong

4. School of Science and Technology Hong Kong Metropolitan University Ho Man Tin Hong Kong

Abstract

AbstractThe terahertz frequency range is gaining popularity in security, stealth technology, and the future 6G network communication. For the control of severe terahertz electromagnetic interference (EMI) pollution, frequency‐selective stealth‐capable shielding materials are being explored to mask terahertz signals. For the realization of masking terahertz signals, the robustness, lightweight, and shape‐conformable materials with excellent terahertz EMI shielding/absorption are crucial. Here, the study reports the fabrication of 3D symmetric pyramidal architectural MXene composite films with frequency‐selective stealth performance characteristics via the facile drop casting method. With the high absorption capability of 2D MXene layers, the MXene composite films exhibit substantial terahertz stealth performance. 3D pyramidal microstructure design leads to frequency selective surface‐assisted reflection resonance in the frequency range of 0.6–1.1 THz. The MXene composite film demonstrates an outstanding maximum terahertz shielding effectiveness (SE) of up to 70.4 dB and a specific SE of 0.55 dB µm−1. These terahertz SE values exceed all of those for MX‐based shielding material designs reported in the literature. The investigation will open a new direction toward developing terahertz EMI shielding thin films with easy integration into any surface for stealth capabilities.

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

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