High Thermal Conductivity in Multiphase Liquid Metal and Silicon Carbide Soft Composites-Reference-Cited by-同舟云学术

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High Thermal Conductivity in Multiphase Liquid Metal and Silicon Carbide Soft Composites

Published:2021-06-26 Issue:14 Volume:8 Page:2100069
ISSN:2196-7350
Container-title:Advanced Materials Interfaces
language:en
Short-container-title:Adv. Mater. Interfaces

Author:

Kong Wilson¹,Wang Zhongyong¹,Casey Nathan¹,Korah Mani M.¹,Uppal Aastha¹,Green Matthew D.¹,Rykaczewski Konrad¹^ORCID,Wang Robert Y.¹^ORCID

Affiliation:

1. School for Engineering of Matter Transport and Energy Arizona State University Tempe AZ 85287 USA

Funder

Semiconductor Research Corporation

National Aeronautics and Space Administration

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admi.202100069

Reference59 articles.

1. Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities

2. Programmable Liquid Metal Microstructures for Multifunctional Soft Thermal Composites

3. Multifunctional Thermal Management Materials with Excellent Heat Dissipation and Generation Capability for Future Electronics

4. Rational Design of Soft, Thermally Conductive Composite Liquid‐Cooled Tubes for Enhanced Personal, Robotics, and Wearable Electronics Cooling

5. Thermal Interface Materials: Historical Perspective, Status, and Future Directions

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